3D PLUS

3D PLUS

641, rue Helene Boucher
78532 Buc Cedex
France
Phone / Fax: show
Website: visit

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About us

3D Plus is a worldwide supplier of advanced high density 3-D microelectronic products and Die and Wafer Level stacking technologies meeting the demand for high reliability, high performance and very small size of today’s and tomorrow’s electronics.

Its portfolio of patented and very advanced stacking technologies starts with standard package scale upward to die-size and wafer-level stacking processes, and, provides its products with the capability to embed heterogeneous active, passive, Opto-electronics and MEMS/MOEMS devices in a single highly miniaturized package.

3D Plus offers catalog products upward to more complex System-In-Package (SiP) solutions and associated services.

3D Plus offers high Quality standards:
  • ISO9001:2000 certification
  • Manufacturing line and capability domain qualified by the European Space Agency (ESA) and the French Space Agency (CNES) for Space applications,
  • Catalog products listed in the ESA EPPL (European Preferred Parts List) for space applications,
  • Customers’ specific qualifications and approvals.

3D Plus is the largest Space qualified catalog products and custom System-In-Packages (SiPs) manufacturer in Europe.

With today customers spread over 30 countries, 3D Plus meets the requirements of high technology industries in industrial, computing/telecom., security and defense, avionics, medical and space markets. The company will continue to strengthen its position in these fields.

History
The technique of interconnection in 3 dimensions of all types of components was set up at Thomson-CSF as of 1989.

Comparing to other existing 2-D traditional solutions, this technology allows gaining a factor of at least 10 on the weight and volume of the components.

At the end of 1995, Pierre Maurice and Christian Val, who designed this technology, bought the initial 3D technology patents and launched 3D Plus Company in order to manufacture cubes based on this principle and patented portfolio.

Strong R&D activities undertaken in collaboration with leading prestigious universities and Key Reference customers, and product and services innovations allow extending and patenting the 3-D technology capability domain and products ranges.

  • In 1997, 3D Plus set up its High Rel. manufacturing line and its products were endorsed by Major Space Prime Contractors for Space Applications.
  • In 2000, the first space qualified products from 3D Plus flew in European Space Agency missions.
  • In 2001, 3D Plus set up a subsidiary in Mc Kinney, Texas, USA.
  • In 2002, 3D Plus built a new manufacturing plant in Buc, France, for pilot-manufacturing of industrial products.
  • In 2002, 3D Plus pioneered the Wafer level stacking technology with the development of its WDoD™ process.
  • In 2003, 3D Plus and 3D Plus USA are certified ISO9001:2000.
  • In 2008, 3D Plus set up an adaptable and cost-optimized supply chain in Asia. It is sized to achieve a fast time-to-market for the new products, and to meet diverse ramp-up and mass manufacturing requirements of the industrial markets.
  • In 2009, with more than 30 000 modules in Space, and with more than 9 years of Flight Heritage with no Failure, 3D Plus is recognized as the largest Space qualified catalog products and custom System-In-Packages (SiPs) manufacturer in Europe.

3D Plus offers a full lineup of radiation tolerant products including memories, POL converters and peripherals, and, industrial memories, camera heads and more complex System-In-Package (SiP) solutions.

Our State-of-the Art stacking technologies and recognized design, manufacturing and test expertise are the foundation and the strength of 3D Plus Products, and, they bring breakthrough advantages to our customers’ electronic designs:
  • Extreme miniaturization / very small form factor
  • Very high density
  • High performance / very high speed / excellent signal integrity
  • High reliability
  • Rugged to extremely harsh environments and Space radiations
  • Space Qualification and Recognized flight heritage
  • Recognized Turnkey design, manufacturing and test

Our catalog products and SiP solutions respond to a diverse range of needs and meet the requirements of the most demanding applications in the industrial, computing/telecom., security and defense, avionics, medical and space markets.
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Last updated: Jul 14, 2010

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